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manufacture capability

Hole drilling

NC hole drilling

Φ 0.1 mm

PTH hole

Φ 0.2 mm

Drilling hole in punching

Φ 0.5 mm

Trace Width/Pitch

Single-sided boards

Width 50 μm / Pitch 50 μm

Double-sided boards

Width 75 μm / Pitch 75 μm

Lamination

Coverlay

± 0.3 mm

Stiffener (PI/PET/FR-4Supporting board)

± 0.3 mm

Tape/Adhesive

± 0.3 mm

Surface treatment

Solder plating (Sn/Pb)

2 ~ 10 μm

Tin immersion

0.5 ~ 1 μm

HASL

2 ~ 10 μm

Tin/Lead printed

60 ~ 120 μm

Cupper Plating

2 ~ 10 μm

Electrolytic gold Plating

Au : 0.03 ~ 0.4 μm Ni : 2 ~ 8 μm

Electrolytic-free gold Plating

Au : 0.03 ~ 0.15 μm Ni : 2 ~ 6 μm

FLUX

Printing

Matte/glossy white ink

Min text width 1mm

Matte/glossy black ink

Min text width 0.2mm

Insulated black ink

Deviation ± 0.5mm

Silver paste

Deviation ± 0.5mm

Yellow ink

Deviation–general ± 0.5mmspecial ± 0.1mm

Green ink

Deviation–general ± 0.5mmspecial ± 0.1mm

Punching

Min hole punching

0.5 mm

Hole punching tolerance

± 0.05 mm

Outline tolerance

± 0.07 mm

Deviation tolerance

± 0.07 mm

Number of layer

Flexible boards

6 layers

Rigid-Flex boards

6 layers

 

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