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  • Development of the PCBs 2015-03-09

    Accelerating performance requirements are driving the demand for high-speed, multilayer PCBs. Traditional manufacturing methods for laminating these layered boards and removing residue from the vias are no longer effective. The use of radio frequency driven, low-pressure plasma provides an efficient, cost-effective and environmentally friendly method for surface treatment and c...

  • Development of High Density Interconnect (HDI) Ablation and Imaging Technologies in PCB and Electronics Manufacture 2015-03-09

    Driven by miniaturisation of electronics products, microvia and fine-line technologies are the key technologies for 21st High Density Interconnect (HDI) manufacture in PCB and Electronics industries. Microvia ablation has been attractive for its speed and throughput. However, the drawback has been the additional photoimaging process to etch the via pattern. Work is needed to deve...

  • Development Plasma treatment for PCB fabrication process 2015-03-09

    Accelerating performance requirements are driving the demand for high-speed, multilayer PCBs. Traditional manufacturing methods for laminating these layered boards and removing residue from the vias are no longer effective. The use of radio frequency driven, low-pressure plasma provides an efficient, cost-effective and environmentally friendly method for surface treatment and c...

  • Advanced Printed Circuit Board (PCB) Material Using Nano-composite as Filler 2015-03-09

    The proven product performance and existing manufacturing platform have allowed PCB materials entry into the realm of chip packaging. However, traditional PCB materials are expected to fall short of the advancing performance requirements. Consequently, new high-performance materials must be considered and evaluated for their mechanical attributes and thermal properties. R...

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